---
kind: "section"
citation: "40 C.F.R. § 63.7182"
title: "40"
number: "63.7182"
heading: "What parts of my facility does this subpart cover?"
url: "https://uscodex.org/cfr/40/63.7182"
---

# §63.7182. What parts of my facility does this subpart cover?

- (a) This subpart applies to each new, reconstructed, or existing affected source that you own or operate that manufactures semiconductors.
- (b) An affected source subject to this subpart is the collection of all semiconductor manufacturing process units used to manufacture p-type and n-type semiconductors and active solid-state devices from a wafer substrate, including research and development activities integrated into a semiconductor manufacturing process unit. A semiconductor manufacturing process unit includes the equipment assembled and connected by ductwork or hard-piping including furnaces and associated unit operations; associated wet and dry work benches; associated recovery devices; feed, intermediate, and product storage tanks; product transfer racks and connected ducts and piping; pumps, compressors, agitators, pressure-relief devices, sampling connecting systems, open-ended valves or lines, valves, connectors, and instrumentation systems; and control devices.
- (c) Your affected source is a new affected source if you commence construction of the affected source after May 8, 2002, and you meet the applicability criteria in [§ 63.7181](/cfr/40/63.7181.md) at the time you commence construction.
- (d) Your affected source is a reconstructed affected source if you meet the criteria for “reconstruction,” as defined in [§ 63.2](/cfr/40/63.2.md).
- (e) **Your source is an existing affected source if it is not a new or reconstructed affected source.**

## Notes

### Source

Source: 68 FR 27925, May 22, 2003, unless otherwise noted.

### Authority

Authority: 42 U.S.C. 7401 et seq.

### Source

Source: 57 FR 61992, Dec. 29, 1992, unless otherwise noted.