---
kind: "section"
citation: "40 C.F.R. § 63.11504"
title: "40"
number: "63.11504"
heading: "Am I subject to this subpart?"
url: "https://uscodex.org/cfr/40/63.11504"
---

# §63.11504. Am I subject to this subpart?

- (a) You are subject to this subpart if you own or operate a plating and polishing facility that is an area source of hazardous air pollutant (HAP) emissions and meets the criteria specified in [paragraphs (a)(1) through (3)](#a-1..a-3) of this section.
  - (1) A plating and polishing facility is a plant site that is engaged in one or more of the processes listed in [paragraphs (a)(1)(i) through (vi)](#a-1-i..a-1-vi) of this section.
    - (i) Electroplating other than chromium electroplating (i.e., non-chromium electroplating).
    - (ii) **Electroless or non-eletrolytic plating.**
    - (iii) Other non-electrolytic metal coating processes, such as chromate conversion coating, nickel acetate sealing, sodium dichromate sealing, and manganese phosphate coating; and thermal spraying.
    - (iv) **Dry mechanical polishing of finished metals and formed products after plating or thermal spraying.**
    - (v) **Electroforming.**
    - (vi) **Electropolishing.**
  - (2) A plating or polishing facility is an area source of HAP emissions, where an area source is any stationary source or group of stationary sources within a contiguous area under common control that does not have the potential to emit any single HAP at a rate of 9.07 megagrams per year (Mg/yr) (10 tons per year (tpy)) or more and any combination of HAP at a rate of 22.68 Mg/yr (25 tpy) or more.
  - (3) Your plating and polishing facility uses or has emissions of compounds of one or more plating and polishing metal HAP, which means any compound of any of the following metals: cadmium, chromium, lead, manganese, and nickel, as defined in [§ 63.11511](/cfr/40/63.11511.md), “What definitions apply to this subpart?” With the exception of lead, plating and polishing metal HAP also include any of these metals in the elemental form.
- (b) [Reserved]

## Notes

### Amendments

[73 FR 37741, July 1, 2008, as amended at 76 FR 57919, Sept. 19, 2011]

### Source

Source: 73 FR 37741, July 1, 2008, unless otherwise noted.

### Authority

Authority: 42 U.S.C. 7401 et seq.

### Source

Source: 57 FR 61992, Dec. 29, 1992, unless otherwise noted.

### Amendments

[73 FR 37741, July 1, 2008, as amended at 76 FR 57919, Sept. 19, 2011]