---
kind: "section"
citation: "31 C.F.R. § 850.201"
title: "31"
number: "850.201"
heading: "Advanced packaging."
url: "https://uscodex.org/cfr/31/850.201"
---

# §850.201. Advanced packaging.


The term advanced packaging means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional (3D) assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.


## Notes

### Authority

Authority: 50 U.S.C. 1701 et seq.; E.O. 14105, 88 FR 54867, 31 U.S.C. 321.

### Source

Source: 89 FR 90462, Nov. 15, 2024, unless otherwise noted.